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2KN 0°45°90°拉拔夹具

夹具

芯片剪切强度试验主要是考核芯片与基板的附着强度，评价芯片安装在基板上所使用的材料和工艺步骤的可靠性，是对芯片封装质量的测试方法。根据剪切力的大小来判断芯片封装的质量是否符合要求，并根据芯片剪切时失效的位置和失效模式来及时纠正芯片封装过程中所发生的问题。改夹具设计压头有三种规格，拉伸剪切夹具一种，可以0度/45度/90度放置，适用于不同规格的电子原器件剪切测试。

特点

特点1：操作简单，可以满足电子元器件0度/45度/90度的剪切测试。
特点2：夹持牢固稳定性较好。
特点3：适合2kN以下试验力的电子元器件剪切试验。
 

规格

2kN

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